Modern buildings demand more than structural integrity — they require thoughtful engineering to perform efficiently, remain durable, and ensure occupant comfort. At HITE Engineering, our Building Science team provides comprehensive assessment and consulting services to address the complex interactions between air, moisture, heat, and materials across the entire building envelope.
Whether you’re facing water infiltration, thermal inefficiency, or premature building deterioration, we offer clear, practical solutions grounded in diagnostics, field testing, and decades of engineering expertise.
We help building owners, architects, contractors, and municipalities ensure performance across all envelope and environmental systems. Our core expertise includes:
Across Ontario’s diverse climates and construction types, we’ve seen how envelope issues can manifest into costly problems. Typical concerns we resolve include:
Our process is grounded in evidence-based engineering, on-site investigation, and practical recommendations.
A Typical Assessment Workflow:
We conduct a walkthrough with your team to understand areas of concern and review available documentation.
We use tools like infrared thermography, moisture meters, and visual inspection to detect underlying issues in wall assemblies, roofs, or cladding.
Our engineers simulate wall or roof systems to understand vapor drive, thermal movement, and envelope durability.
We develop detailed recommendations or construction-ready drawings for rehabilitation, restoration, or envelope upgrades.
You receive a stamped report, annotated photos, and recommendations aligned with building codes and industry best practices.
HITE’s Building Science team supports a wide range of sectors and building types:
Neglecting building science problems can lead to:
Whether you’re troubleshooting a water infiltration issue or planning a full envelope rehabilitation, our Building Science team is ready to help.
Call now to schedule a consultation
Let’s make your building perform the way it was meant to.